Skip to main content
Skip to navigation
Skip to search
DIMA offers a variety of Process Equipment for ACF laminating and Heat-Seal Bonding systems.
DIMA Group Desktop Series is a product range for Reflow Soldering, Heat-Seal Bonding , ACF Laminating process applications. All kind LCD, Flex foil and PCB connections can be made using these systems.
Semi- and fully automated Bonding Systems
Process equipment for bonding applications, suitable for built-in, integrated solutions in new or existing machines.