The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, the C-Drive shows its true colors. Temperature, Force, and Displacement Monitoring give instant feedback on what's occurring at the joint on a full color touch screen display, alarming the operators instantly if the temperature and displacement are out of specifications.
The C-Drive series was engineered to deliver repeatable and accurate force for a wide range of applications. Four different models are available: extremely low forces for delicate applications to very high forces for the most challenging heat seal connectors.
DIMA Group's Innovative Design results in quicker and simpler operation with easily adjusted planarity and rapid hotbar change overs, making the C-Drive an ideal candidate for all environments; from prototyping labs to full production. The C-Drive was developed to revolutionize the bench-top bonding heads by providing features and precision normally found in complete turnkey systems but at an affordable cost.