Hot Bar Application Processes

Nordson DIMA offfers several Hot Bar application processes:


Heat Seal and ACF Bonding

(Anisotropic Conductive Adhesive Bonding)

Electrical conductive adhesive bonds can be made between flexible and rigid circuit boards, glass panel displays and flex foils. In the process the adhesive will be heated and cooled under pressure by means of a thermode (hot bar). It is divided into two techniques:

ACF Laminating Nordson - Anisotropic Conductive Film Bonding

The ACF Bonding process is used for fine-pitch applications (> 30 mircon) as the particle size is smaller than those of heat seal connectors (HSCs).


Heat Seal Bonding- Heat-Seal Bonding / ACF Final Bonding

The Heat-Seal Bonding process is applied with flex materials, using adhesive pre-printed on the connector foil / flex foil.

>> Read more about: Heat Seal and ACF Bonding


Hot Bar Reflow Soldering

Hot Bar Reflow Soldering Nordson DIMAHot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element (called a thermode or a hot bar) to a sufficient temperature to melt the solder. After this the parts are cooled below the solidification temperature to form a permanent electro-mechanical bond.

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Heat Staking

Heat Staking Nordson DIMAHeat Staking is a pulsed heat process to join two or more parts, of which one is at least made out of plastic. The process is to deform the plastic material using heat and force at a set process time. The bond is made by partially de-forming the plastic part in order to fix the other.

>> Read more about: Heat Staking